Silicone Thermal Paste Heat Transfer Grease Heat Sink Syringe Packaging HY510 Thermal Conductive Grease Paste For CPU GPU Chipset Cooling Compound Thermal Paste Syringe Silicon Syringe

 

Specification:                         

Net Weight: 30g

Thermal conductivity > 1.42 w / m-k

Thermal impedance < 0.225 c-in 2 / W

Instantaneous temperature resistance - 50 ~ 300 ℃

Working temperature - 30 ~ 150 ℃

Component: Silicon compounds ＜ 50%,30% of carbon compounds,Metal oxide compounds 20%

Package Included

1 X HY510 Thermal Paste

 

Features:                                

HY510 gray thermal conductive silicone grease, this kind of silicone grease is added with high thermal conductivity graphite powder, metal powder and other substances to achieve better thermal conductivity effect. This product is widely used in gap filling between CPU and radiator, high-power diodes, triodes, silicon controlled elements, heat transfer at the slit in contact with the substrate. With the help of the high thermal conductivity of graphite, graphite thermal conductive silicone grease can fill the gap between IC or triode and heat sink, increase the contact area between them, and achieve good heat dissipation effect.

 

Working principle: Fill the for gap between heating element and the cooling device; Increase the contact area, so as to achieve the soundest effect of thermal conductivity.

Method of use: It's normal phenomena, there is a little silicone oil floating above. Please stir well before use. Keep be painted surface clean, and painted directly with tools (such as syringe, scraper, finger cot, etc.)

 

NOTE:

1. Please allow about 1-5mm differences due to manual measurement

2. Due to the difference between different monitors, the picture may not reflect the actual color of the item