Product description
HY510 CPU Silicone Heatsink Thermal Paste Compound 1g with Applicator Tool
Syringe design, for easy operation
Helps disperse the heat from CPU to heat sink effectively
Suitable for: CPU heat sink or chip
High temperature resistance, non-toxic, tasteless, non-corrosive
Primary use: Thermal coupling of electrical/electronic devices to heat sinks
Special properties: High conductivity, low bleed, stable at high temperatures
Thermal conductivity: >1.829W/m-k
x 1pc HY510 CPU Silicone Heatsink Thermal Paste Compound 1g
x 1pc Applicator Tool (Random Color)