Product description
Mechanic IX5 Ultra universal preheating platform mobile phone motherboard layered bonding glue removal dot matrix repair heater
MECHANIC universal preheating platform
Air gun/soldering iron free
Layering/tin planting/bonding/debonding/dot matrix maintenance
Windless gun soldering iron
Free control of temperature, adjustable from 20 to 260 ° C
Suitable for various sizes of mobile phone motherboards