Product description
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Mechanic IX5 Ultra universal preheating platform mobile phone motherboard layered bonding glue removal dot matrix repair heater
MECHANIC universal preheating platform
Air gun/soldering iron free
Layering/tin planting/bonding/debonding/dot matrix maintenance
Windless gun soldering iron
Free control of temperature, adjustable from 20 to 260 °C
Suitable for various sizes of mobile phone motherboards
1. This is a mobile phone maintenance component. 2. Please master the replacement technology yourself or ask a professional to replace it 3. If you encounter any problems in use, please contact us in time and we will help you soe them as soon as possible
f you buy more quantity, Please contact us .
buy more parts. used the "Add to cart" we wikk make the discount for you.