Product description
Rosin solder paste flux, made of no acid, lead-free- soldering flux paste which is not easy to dump. -BGA flux paste, easy to tin-, less residue-.
High-purity,good helper for repairing and welding.
Application: for Phone Motherboard- BGA- Soldering Repair
Function: for Phone PCBs, PC Cards, PGA-, SMD- Rework
Suitable for: for Phone PC Cards and Other Sophisticated Electronic Chip-level Flux Welding
Material: Rosin Soldering Paste
Size:approx 24x57mm/0.94x2.24in
Type: Rosin-based Soldering Flux Paste
Model Number: Welding Flux
Application: for Phone Motherboard-BGA Soldering Repair
Function: for Phone PCBs, PC Cards, PGA-, SMD- Rework
Suitable for: for Phone PC Cards and Other Sophisticated Electronic Chip-level Flux Welding
Before welding, the welding site and welding wire should be cleaned.
Due to the problems of lighting effects and shooting angles, there will be certain tolerances in the product, please understand.
Please allow 0-1cm error due to the manual measurment.