Product description
Rosin solder paste flu*, made of no acid, lead-free- soldering flu* paste which is not easy to dump. -BGA flu* paste, easy to tin-, less residue-.
High-purity,good helper for repairing and welding.
Application: for Phone Motherboard- BGA- Soldering Repair
Function: for Phone PCBs, PC Cards, PGA-, SMD- Rework
Suitable for: for Phone PC Cards and Other Sophisticated Electronic Chip-level Flu* Welding
Material: Rosin Soldering Paste
Size:appro* 24*57mm,0.94*2.24in
Type: Rosin-based Soldering Flu* Paste
Model Number: Welding Flu*
Application: for Phone Motherboard-BGA Soldering Repair
Function: for Phone PCBs, PC Cards, PGA-, SMD- Rework
Suitable for: for Phone PC Cards and Other Sophisticated Electronic Chip-level Flu* Welding
Before welding, the welding site and welding wire should be cleaned.
Due to the problems of lighting effects and shooting angles, there will be certain tolerances in the product, please understand.
Please allow 0-1cm error due to the manual measurment.